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PRODUCT DETAILS
| Layer | 6L |
| Finished Thickness(mm) | 1.6 |
| Material type | KB 6165G |
| Copper thickness(oz) | All 1/1 |
| Minimum aperture (mm) | 0.2 |
| Minimum line width/line spacing (mm) | 0.1 |
| Other characteristics | Halogen-free material |
PRODUCT RECOMMENDATION
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- 6L FR-4 ≥30μm Copper Plated Through Hole PCB
- Number of Layers: 6L
- Board Thickness: 3.6
- Surface Treatment: Immersion Tin
-
- 6L FR-4 BGA 0.2mm PCB
- Number of Layers: 6L
- Board Thickness: 2.4
- Surface Treatment: Immersion gold
-
- 6L, FR-4, Halogen-free Material, Immersion Gold, PCB
- Number of Layers: 6L
- Board Thickness: 1.6
- Surface Treatment: Immersion gold
-
- 6L, FR-4, Dimensional Tolerance ±0.05mm, PCB
- Number of Layers: 6L
- Board Thickness: 0.8
- Surface Treatment: Immersion gold
-
- 10L FR-4 Immersion Gold PCB
- Number of Layers: 10L
- Board Thickness: 1.6
- Surface Treatment: Immersion gold
-
- 4L FR-4 Flatness ≤3µm PCB
- Number of Layers: 4L
- Board Thickness: 0.5
- Surface Treatment: Immersion gold
-
- 8L FR-4 Immersion Gold+OSP PCB
- Number of Layers: 8L
- Board Thickness: 0.8
- Surface Treatment: Immersion gold+OSP
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- 10L FR-4 Back Drill PCB
- Number of Layers: 10L
- Board Thickness: 1.6
- Surface Treatment: Immersion Tin
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